As mobile devices become increasingly compact and energy-efficient, suppliers need to produce semiconductor chips that are thinner with a larger surface area. The market for semiconductor lithography equipment with greater FOWLP functionality continues to expand, reflecting increased demand for high-density redistribution layer wiring that requires high-resolution lithography.
While the FPA-5520iV achieves a resolution of 1.0 µm (micrometers3), the FPA-5520iV HR Option employs a new projection optical system that achieves a resolution of 0.8 µm, the finest resolution4 available in packaging-oriented lithography systems. This advancement allows finer circuit patterning to enable the further miniaturization of semiconductor chips while allowing increasing data bandwidth and processing speeds.
The FPA-5520iV HR Option maintains the same basic functionality, performance and productivity of the FPA-5520iV stepper (released in July 2016) for FOWLP processes while delivering a higher resolution of 0.8 µm. FPA-5520iV HR Option steppers provide improved productivity by offering such capabilities as handling extremely warped reconstituted wafers5, a problem encountered during mass production using FOWLP technology, as well as an improved rate of operation by automatic detection of alignment marks6 of chips that are known to be placed non-uniformly on reconstituted wafers.
